Innovative cooling systems play a significant role, ensuring these integral supercomputers and data centers continue to operate without overheating. Discover how Parker’s fluid conveyance thermal management connector solutions are here to help.
Parker offers specialised departments for data center cooling applications, bringing deep expertise, engineering capabilities, and experience to deliver customised solutions tailored to specific needs. Our rigorously tested fittings, quick couplings, and hoses withstand the most demanding data center environments, promising enduring reliability and uptime. Benefit from Parker's global availability, support, and maintenance services, ensuring your liquid cooling systems consistently operate at their best.
Parker is an active participant in the Open Compute Project (OCP), a community-driven organisation dedicated to standardising the design and performance of hardware for data centers ranging from small to hyper-scale. We are not merely adhering to industry standards; we are instrumental in defining them, both now and in the future. No matter your application, our experts are ready to help you solve your toughest thermal management challenges and future-proof your data centers.
Given the critical need for high reliability and uptime in data centers, Parker's fittings, quick couplings, and hose products undergo rigorous testing and quality assurance to ensure they can withstand demanding conditions long-term. Additionally, Parker offers comprehensive global availability, support, and maintenance services to keep your liquid cooling solutions operating at peak performance throughout the data center's life.
White Paper
Discover how ZutaCore® is effectively managing the growing issue of heat dissipation to maintain a competitive advantage. Learn how ZutaCore® is pioneering the shift toward a zero-emissions data industry with their direct-to-chip, waterless dielectric liquid cooling solution.
No matter your application, our experts are ready to help you solve your toughest thermal management challenges.
On-Demand Webinar
Continued demand to increase computing power and applications that require intense processing leaves data center leaders looking for new ways to take the heat off of electronics and increase efficiencies. In this webinar recording, you will learn about:
Success Story
Discover how Parker and Eviden Atos' collaboration has not only enhanced the performance and energy efficiency of Eviden’s BullSequana XH3000 supercomputers but also earned them a top spot in the Green 500 ranking for environmentally friendly supercomputers.
Success Story
Effectively managing the growing issue of heat dissipation is critical to maintaining a competitive advantage. Learn how this customised solution provides higher performance, economy and sustainability for data centers, regardless of size.
This cooling method utilises the process of evaporating a liquid fluid (typically a refrigerant) into a vapor to remove heat from electronic components. The process involves pumping a refrigerant into a heat exchanger or cold plate that is located directly on the chip. Because there is phase change to the fluid, it is more efficient than keeping the fluid in a same state. This is called latent heat exchange.
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We have liquid cooling application experts ready to help in EMEA.