Parker Chomerics unveils THERM-A-GAP™ GEL 50TBL, dispensable thermal gel that excels in thin bond line applications | Parker
"Certified Mobile Electrification Center"

THERM-A-GAP GEL 50TBL is available in syringe, cartridge and pail containers, offering standard fill volumes from 10 to 2500 cc.

Learn more about the new THERM-A-GAP GEL 50TBL at: https://ph.parker.com/gb/en/product-list/therm-a-gap-gel-50tbl-thermally-conductive-gel

MEDIA CONTACT

Melanie French
Marketing Communications Manager
Phone +44 (0) 1494 455447
Email: mfrench@parker.com

Lisa de Beer
Public Relations EMEA
Parker Hannifin
Phone: +27 (0)11 961 0700
Email: lisa.debeer@parker.com



High Wycombe, Bucks, UK, 9th August 2023 – The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, is introducing a new thermal interface material for use in very thin bond lines without compromising performance. THERM-A-GAP™ GEL 50TBL is a new dispensable thermal gel that offers 5 W/m-K bulk thermal conductivity. At a minimum bond line thickness of 0.05 mm, the apparent thermal conductivity exceeds 10 W/m-K.

With a ‘TBL’ suffix that stands for ‘thin bond line’, the new thermal gel needs no mixing or secondary curing, supporting simple application and the potential to undertake rework. The product offers a flow rate of 25 g/min using a 30 cc syringe with 2.5 mm orifice (at 621 kPa). Another attribute of THERM-A-GAP GEL 50TBL is that it requires very low compressive force to conform under assembly pressure, ensuring components, solder joints and leads encounter minimal stresses.

Like all thermal gels from Parker Chomerics, THERM-A-GAP GEL 50TBL carries a formulation that accommodates today’s high-performance and high-reliability electronic demands, while being perfectly suited to automated dispensing machines and field repair situations. Typical applications for this advanced thermal gel, which offers low thermal impedance and avoids any pump-out effect with temperature changes, include automotive electronic control units (ECUs), telecommunications base stations, consumer electronics, power supplies, semiconductors, LEDs, microprocessors and graphics processors. As a point of note, the material is primarily for thin bond lines and is not typically intended for use as a filler in gaps larger than 0.50 mm.

The electrical properties of THERM-A-GAP GEL 50TBL include: 200 Vac/mm dielectric strength (Chomerics test method); 1014 Ωcm volume resistivity (ASTM D257); 7.0 dielectric constant at 1000 kHz (ASTM D150); and 0.002 dissipation factor at 1000 kHz (Chomerics). RoHS-compliant, the material can operate at temperatures extending from -55°C to +200°C.

THERM-A-GAP GEL 50TBL is available in syringe, cartridge and pail containers, offering standard fill volumes from 10 to 2500 cc.

Learn more about the new THERM-A-GAP GEL 50TBL at: https://ph.parker.com/gb/en/product-list/therm-a-gap-gel-50tbl-thermally-conductive-gel

About Chomerics

Chomerics is a division of Parker Hannifin Corporation and is part of the Engineered Materials Group. It is the global leader in development and application of electrically and thermally conductive materials in electronics, transportation and alternative energy systems. For details, please visit www.parker.com/chomerics

About Parker Hannifin

Parker Hannifin is a Fortune 250 global leader in motion and control technologies. For more than a century, the company has been enabling engineering breakthroughs that lead to a better tomorrow. Learn more at www.parker.com or @parkerhannifin.