Electronics Industry Solutions

Electronics

Parker’s electrically conductive plastic enclosure materials, microwave absorbent coatings and liquid and semi-liquid heat dissipating systems provide space-saving and reliable EMI, microwave, RF and isothermal protection solutions.

Innovative cooling systems play a significant role, ensuring these integral supercomputers and data centers continue to operate without overheating. Discover how Parker’s fluid conveyance thermal management connector solutions are here to help.

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Integrated circuit and printed circuit board manufacturers must address increasing performance expectations, tighter spaces and thermal management challenges, just like the mobile electronics, automobile and aerospace OEMs who use their devices. Parker’s electrically conductive plastic enclosure materials, microwave absorbent coatings and liquid and semi-liquid heat dissipating systems provide space-saving and reliable EMI, microwave, RF and isothermal protection solutions.

Featured Products

THERM-A-GAP™ TC50 Thermal Putty

This high performance, single-component, fully cured and dispensable compound was developed to conduct heat between a hot component and a heat sink or enclosure. Its paste-like consistency enables controlled dispensing in varying thicknesses and is ideal for automated dispensing.

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Liquid Cooled Multiple Platform Enclosures

Parker’s SprayCool® enclosures incorporate a patented direct-spray evaporative technology in this closed-loop liquid cooling system, protecting electronics and ensuring survivability in harsh environments. It sets the standard for scalable thermal performance and simplified integration.

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Circuit Board Package Level EMI Shielding Paints

Parker Chomerics CHO-SHIELD 571 and CHO-SHIELD 604 electrically conductive coatings are designed for adhesion to semiconductor packages. When combined with innovative technologies and packaging designs, these paints can provide board level or package level EMI shielding of electrical components.

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Learn how Parker's quick connection solutions for thermal management, including rigid piping, quick coupling and push-in fittings, meet the requirements of liquid cooling circuits in electronic applications such as data centers, supercomputers, electronic devices and semiconductor production.